Test |
Method |
Hybrids |
Diodes |
Transistors |
Mi-Std-833 |
Mil-Std-750 |
1 |
Internal Visual |
2010
2017 |
2072 |
100% |
Optional |
Optional |
2 |
Temperature Cycling or Thermal Shock |
1010
1011 |
1051 |
100% |
100% |
100% |
3 |
Constant Acceleration or Mechanical Shock |
2001
2002 |
2006 |
100% |
Optional |
100% |
4 |
Particle Impact Noise Detection (PIND) |
2020 |
2052 |
Optional |
Optional |
Optional |
5 |
Serialization |
In accordance with applicable Device Specification |
In accordance with applicable Device Specification |
Optional |
Optional |
Optional |
6 |
Interim
(pre-burn-in) Electrical Parameters |
In accordance with applicable Device Specification |
In accordance with applicable Device Specification |
--- |
100% |
100% |
7 |
Burn-in Test |
1015 |
1039 |
100% |
100% |
100% |
8 |
Percent Defective Allowable (PDA) Calculation |
--- |
--- |
Optional |
5% |
10% |
9 |
Final Electrical Test
(Group A) |
In accordance with applicable Device Specification |
In accordance with applicable Device Specification |
100% |
100% |
100% |
10 |
Seal (Fine and Gross) |
1014 |
1071 |
100% |
100% |
100% |
11 |
Radiographic |
2012 |
2076 |
Optional |
Optional |
Optional |
12 |
External Visual |
2009 |
2071 |
100% |
100% |
100% |
